Supporting Equipment
Wafer Cutter
Precision wafer cutting machine for creating uniform wafer pieces and shapes with clean, accurate cuts.
Key Features
Precision cutting
Adjustable cutting sizes
Clean cut edges
High cutting speed
Easy blade replacement
Minimal waste generation
Product Gallery
Technical Specifications
Wafer Cutter Specifications
Cutting Width:Up to 600mm
Cutting Speed:Up to 100 cuts/min
Blade Type:Stainless steel
Power Consumption:2.5 KW
Machine Dimensions:2000 x 1000 x 1400mm
Weight:380 kg
Applications
Wafer cutting
Shape creation
Size standardization
Production finishing
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