Precision cutting machine for wafer sheets, designed to deliver consistent, clean cuts for sandwich formation or packaging.
The Wafer Cutter by D.E. Technics is engineered for high-efficiency cutting of multilayered wafer sheets into uniform pieces. It is the final stage in the wafer line process, following the spreading and sandwiching of cream layers.
Built with robust stainless steel construction, the machine offers reliable performance, easy cleaning, and high output precision. It ensures that each wafer bar is accurately sized for packaging, optimizing downstream production processes.
| Length | Height |
|---|---|
| 2000 mm | 1100 mm |
It performs the final stage of wafer production by cutting multilayered wafer sheets into uniform bars for sandwich formation or packaging.
The cutter is built from robust stainless steel, offering easy cleaning and reliable performance.
It delivers consistent cutting accuracy, has a compact footprint and offers easy access for maintenance.
The cutter's length is approximately 2000 mm and its height is 1100 mm.
In wafer sandwich production, industrial confectionery lines and sheet-based bakery automation.