Precision cutting machine for wafer sheets, designed to deliver consistent, clean cuts for sandwich formation or packaging.
The Wafer Cutter by D.E. Technics is engineered for high-efficiency cutting of multilayered wafer sheets into uniform pieces. It is the final stage in the wafer line process, following the spreading and sandwiching of cream layers.
Built with robust stainless steel construction, the machine offers reliable performance, easy cleaning, and high output precision. It ensures that each wafer bar is accurately sized for packaging, optimizing downstream production processes.
| Length | Height |
|---|---|
| 2000 mm | 1100 mm |